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Defoaming machine
It is mainly used to eliminate the bubbles produced in the bonding process of TN, STN, TFT liquid crystal glass substrate and polarizer, and also used to eliminate the bubbles in the bonding process of touch screen glass to glass and glass to OCA conductive film.
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It is mainly used to eliminate the bubbles produced in the bonding process of TN, STN, TFT liquid crystal glass substrate and polarizer, and also used to eliminate the bubbles in the bonding process of touch screen glass to glass and glass to OCA conductive film.



Parameter

Power

220VAC +/-10%, 50 ～ 60 Hz, 10kVA

Operating environment

23ºC +/-5ºC, 40% ～ 100% humidity

Pressure

5 ～ 7kgf/cm²

Gas consumption rate

50L/M

、Can body specification

250mm × 330mm

、Overall dimension of equipment

400mm × 410mm × 430mm

、Weight

28kg

performance

working pressure

0.45 ～ 0.6 Mpa

temperature range

30℃ ～ 50℃

operation mode

Semi automatic defoaming

Work cycle

10 ～ 20min

Size

13 inch

Protection system

Mechanical and electric double interlock

Pressure system

Equipped with pressure controller, regulator and screw valve

The working cabin of the equipment is made of carbon steel.

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